半導体装置

Abstract

PROBLEM TO BE SOLVED: To provide a semiconductor device achievable of heat dissipation property and insulation property.SOLUTION: The semiconductor device includes: a heat sink; a semiconductor element disposed on a component-side surface of the heat sink; and a seal body, enclosing the heat sink and the semiconductor element, having a part on the opposite surface side to the component-side surface of the heat sink smaller in thickness than a part of the component-side surface of the heat sink. A first convexoconcave is formed on the surface opposite to the component-side surface of the heat sink, and a second convexoconcave larger than the first convexoconcave is formed on a surface intersecting with the surface opposite to the component-side surface of the heat sink.
【課題】放熱性と絶縁性の両立が可能な半導体装置を提供する。 【解決手段】 放熱板と、前記放熱板の被実装面上に設けられた半導体素子と、前記放熱体及び前記半導体素子を包み、前記放熱板の前記被実装面とは反対側の面側の部分の厚みが、前記放熱板の前記被実装面側の部分の厚みよりも小さい、封止体と、を備え、前記放熱板の前記被実装面とは反対側の前記面に、第1の凹凸が形成され、前記放熱板の前記被実装面とは反対側の前記面と交差する面に前記第1の凹凸よりも大きい第2の凹凸が形成された半導体装置を提供する。 【選択図】図1

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    Publication numberPublication dateAssigneeTitle
    JP-2015041684-AMarch 02, 2015新電元工業株式会社, Shindengen Electric Mfg Co LtdManufacturing method of semiconductor device, semiconductor device, and lead frame
    JP-WO2015173906-A1April 20, 2017三菱電機株式会社半導体装置の製造方法